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A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

  • Published:1988-03 Issue:3 Volume:19 Page:675-686
  • ISSN:0360-2133
  • Container-title:Metallurgical Transactions A
  • language:en
  • Short-container-title:MTA

Author:

Tuah-Poku Isaac,Dollar M.,Massalski T.B.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference13 articles.

1. D. S. Duvall, W. A. Owczarski, and D. F. Paulonis:Welding Journal, 1974, vol. 53, pp. 203–14.

2. J. T. Niemann and R. A. Garrett:Welding Journal, Research Suppl., 1974, vol. 53, pp. 175–84.

3. R. R. Wells:Welding Journal, Research Suppl., 1976, vol. 55, pp. 20–27.

4. G. Lesoult: Center for Joining of Materials Report, Carnegie Mellon University, Pittsburgh, PA, Sept. 1976.

5. R. F. Sekerka: Carnegie Mellon University, Pittsburgh, PA, unpublished research, 1979.
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