Author:
Mulukutla M,Singh A,Harimkar S P
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference27 articles.
1. Electrodeposition of alloys: Present state of the art
2. Pulse and pulse reverse plating—Conceptual, advantages and applications
3. Kanani N: ‘Electroplating: basic principles, processes and practice’, 1st edn, 354; 2004, Oxford, Elsevier Science.
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