Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/0020296715Z.000000000251
Reference25 articles.
1. A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating
2. Filling of microvia with an aspect ratio of 5 by copper electrodeposition
3. An electroplating method for copper plane twin boundary manufacturing
4. Problems of PCB microvias filling by conductive paste
5. Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System
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