Experiments on the aging of Sn–Ag–Cu solder alloys
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites
Link
http://www.tandfonline.com/doi/pdf/10.1179/003258905X37620
Reference4 articles.
1. Diffusion of Gold and Silver in Tin Single Crystals
2. Interstitial Diffusion of Copper in Tin
3. 'Test procedures for developing solder data': NIST Special Publication 960-8, August, 2002.
4. Determination of the eutectic structure in the Ag-Cu-Sn system
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