Electroless gold plating from tetrachloroaurate solutions containing hexacyanoferrate(II) ions-Reference-Cited by-同舟云学术

Electroless gold plating from tetrachloroaurate solutions containing hexacyanoferrate(II) ions

Published:2007-09 Issue:5 Volume:85 Page:254-259
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Vrublevskaya O. N.,Vorobyova T. N.,Lee H.-K.,Koo S.-B.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/174591907X229662

Reference14 articles.

1. E. H. Reid and W. Goldie (eds.): ‘Gold plating technology’, Vol. 11; 1974, Ayr, Scotland, Electrochemical Publications Ltd.

2. Y. Okinaka: in ‘Electroless plating: fundamentals and application’, (ed. G. O. Mallory and J. B. Hajdu), Fl, 1–273; 1990, Orlando, FL, American Electroplaters and Surface Finishers Society.

3. Some recent topics in gold plating for electronics applications

4. Electroless Deposition of Metals and Alloys

5. Substrate (Ni)-Catalyzed Electroless Gold Deposition from a Noncyanide Bath Containing Thiosulfate and Sulfite

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