Characteristics of nickel sulphide reduction in Ni2+free background and Watts nickel plating electrolytes-Reference-Cited by-同舟云学术

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Characteristics of nickel sulphide reduction in Ni2+free background and Watts nickel plating electrolytes

Published:2006-05 Issue:3 Volume:84 Page:162-167
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Valiulienė G.,Žielienė A.,Jasulaitienė V.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/174591906X123994

Reference21 articles.

1. Surface copper immobilization by chelation of alizarin complexone and electrodeposition on graphite electrodes, and related hydrogen sulfide electrochemistry; matrix isolation of atomic copper and molecular copper sulfides on a graphite electrode

2. Some Regularities of Formation of Cu2–xS Coatings

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent;RSC Advances;2021

2. EQCN study of electrochemical modification of bismuth sulphide films in Co2+containing electrolyte;Transactions of the IMF;2011-09

3. EQCM study of electrochemical modification of Bi2S3 films in the Zn2+-containing electrolyte;Journal of Electroanalytical Chemistry;2009-08

4. Electrochemical modification of Bi2S3 coatings in a nickel plating electrolyte;Journal of Solid State Electrochemistry;2009-02-20

5. Study of Bi2S3interaction with Ni(II) ions;Transactions of the IMF;2008-11

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