Fabrication and Challenges of Cu-to-Cu Wafer Bonding
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Publisher
The Korean Microelectronics and Packaging Society
Link
http://ocean.kisti.re.kr/downfile/crosscheck/ishm/JAKO201222350106742.pdf
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Multi-Step Mechanical and Thermal Homogenization for the Warpage Estimation of Silicon Wafers;Micromachines;2024-03-18
2. Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage;IEEE Transactions on Semiconductor Manufacturing;2023-08
3. Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication;IEEE Transactions on Electron Devices;2022-11
4. Study of wafer warpage reduction by dicing street;Japanese Journal of Applied Physics;2022-06-10
5. Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
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