Author:
Yang Xiao-Hui,Kang Pei-Bin,Xu Fan-Jie,Jin Yu-Cheng,Tang Yu-Hang,Su Yan-Yi,Qiu Jiang-Pen,Cheng Jun
Publisher
Science China Press., Co. Ltd.
Subject
Materials Chemistry,General Chemical Engineering,Biochemistry,General Chemistry
Reference87 articles.
1. Kaanta CW, Bombardier SG, Cote WJ, Hill WR, Kerszykowski G, Landis HS, Poindexter DJ, Pollard CW, Ross GH, Ryan JG, Wolff S, Cronin JE. Dual Damascene: A ULSI Wiring Technology. In 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991: 144–152.
2. High Speed Through Silicon Via Filling by Copper Electrodeposition
3. Electroplating: Applications in the Semiconductor Industry
4. Filling of microvia with an aspect ratio of 5 by copper electrodeposition
5. Inhibition of multi-site adsorption of polyethylene glycol during copper via-filling process