Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling

Author:

Verma P1,Chatterjee D2,Nagarajan T1

Affiliation:

1. Precision Engineering and Instrumentation Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, India

2. Hydroturbomachines Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, India

Abstract

With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump—heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 VDC. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5 W. A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump.

Publisher

SAGE Publications

Subject

Mechanical Engineering

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