interiqr: Unobtrusive Edible Tags using Food 3D Printing-Reference-Cited by-同舟云学术

interiqr: Unobtrusive Edible Tags using Food 3D Printing

Published:2022-10-28 Issue: Volume: Page:
ISSN:
Container-title:The 35th Annual ACM Symposium on User Interface Software and Technology
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Author:

Miyatake Yamato¹,Punpongsanon Parinya¹,Iwai Daisuke¹,Sato Kosuke¹

Affiliation:

1. Graduate School of Engineering Science, Osaka University, Japan

Funder

Japan Society for the Promotion of Science

Japan Science and Technology Agency

Publisher

ACM

Reference52 articles.

1. An overview of smart packaging technologies for monitoring safety and quality of meat and meat products;Ahmed Ishfaq;Packaging Technology and Science,2018

2. Measurement of Optical Properties of Foods in Near- and Mid-Infrared Radiation;Almeida M.;International Journal of Food Properties,2006

3. Making Sense of Human-Food Interaction

4. Oliver Bimber and Ramesh Raskar . 2005. Spatial Augmented Reality: Merging Real and Virtual Worlds . A. K. Peters, Ltd. , USA. Oliver Bimber and Ramesh Raskar. 2005. Spatial Augmented Reality: Merging Real and Virtual Worlds. A. K. Peters, Ltd., USA.

5. Densowave. 2019. Micro QR Code. https://www.qrcode.com/en/codes/microqr.html. Densowave. 2019. Micro QR Code. https://www.qrcode.com/en/codes/microqr.html.

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