Silver Tape

Author:

Cheng Tingyu1,Narumi Koya2,Do Youngwook1,Zhang Yang3,Ta Tung D.2,Sasatani Takuya2,Markvicka Eric4,Kawahara Yoshihiro2,Yao Lining3,Abowd Gregory D.1,Oh HyunJoo1

Affiliation:

1. Georgia Institute of Technology, USA

2. The University of Tokyo, Japan

3. Carnegie Mellon University, USA

4. University of Nebraska-Lincoln, USA

Abstract

We propose Silver Tape, a simple yet novel fabrication technique to transfer inkjet-printed silver traces from paper onto versatile substrates, without time-/space- consuming processes such as screen printing or heat sintering. This allows users to quickly implement silver traces with a variety of properties by exploiting a wide range of substrates. For instance, high flexibility can be achieved with Scotch tape, high transparency with polydimethylsiloxane (PDMS), heat durability with Kapton polyimide tape, water solubility with 3M water-soluble tape, and beyond. Many of these properties are not achievable with conventional substrates that are used for inkjet-printing conductive traces. Specifically, our technique leverages the commonly undesired low adhesion property of the inkjet printing films and repurposes these films as temporary transfer media. We describe our fabrication methods with a library of materials we can utilize, evaluate the mechanical and electrical properties of the transferred traces, and conclude with several demonstrative applications. We believe Silver Tape enriches novel interactions for the ubiquitous computing domain, by enabling digital fabrication of electronics on versatile materials, surfaces, and shapes.

Publisher

Association for Computing Machinery (ACM)

Subject

Computer Networks and Communications,Hardware and Architecture,Human-Computer Interaction

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Transient Internet of Things: Redesigning the Lifetime of Electronics for a More Sustainable Networked Environment;Proceedings of the 2nd Workshop on Sustainable Computer Systems;2023-07-09

2. SwellSense: Creating 2.5D interactions with micro-capsule paper;Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems;2023-04-19

3. SkinPaper: Exploring Opportunities for Woven Paper as a Wearable Material for On-Skin Interactions;Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems;2023-04-19

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