Optimal Scheduling and Allocation for IC Design Management and Cost Reduction
Author:
Affiliation:
1. UC San Diego, La Jolla, CA
2. Qualcomm, Inc., Morehouse Drive, San Diego, CA
3. Qualcomm India Private Limited, Whitefield, Bangalore KA
Abstract
Publisher
Association for Computing Machinery (ACM)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Link
https://dl.acm.org/doi/pdf/10.1145/3035483
Reference48 articles.
1. P. Agrawal B. Chatterjee A. B. Kahng P. K. Myana and S. Nath. 2015. Optimal multi-tapeout project scheduling for enterprise-scale design management and cost reduction. Work-in-Progress DAC. P. Agrawal B. Chatterjee A. B. Kahng P. K. Myana and S. Nath. 2015. Optimal multi-tapeout project scheduling for enterprise-scale design management and cost reduction. Work-in-Progress DAC.
2. M. Ayala and C. Artigues. 2010. On Integer Linear Programming Formulations for the Resource-Constrained Modulo Scheduling Problem Rapport LAAS. Technical Report 10393. M. Ayala and C. Artigues. 2010. On Integer Linear Programming Formulations for the Resource-Constrained Modulo Scheduling Problem Rapport LAAS. Technical Report 10393.
3. Tight LP bounds for resource constrained project scheduling
4. D. Bienstock and M. Zuckerberg. 2009. A new LP algorithm for precedence constrained production scheduling. Optimization Online 1--33. D. Bienstock and M. Zuckerberg. 2009. A new LP algorithm for precedence constrained production scheduling. Optimization Online 1--33.
5. CROSS cyclic resource-constrained scheduling solver
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