Author:
Feng Yan,Mehta Dinesh P.,Yang Hannah
Cited by
2 articles.
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1. System Aware Floorplanning for Chip-Package Co-design;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
2. Fixed-outline floorplanning using robust evolutionary search;Engineering Applications of Artificial Intelligence;2007-09