How to Kill the Second Bird with One ECC: The Pursuit of Row Hammer Resilient DRAM-Reference-Cited by-同舟云学术

How to Kill the Second Bird with One ECC: The Pursuit of Row Hammer Resilient DRAM

Published:2023-10-28 Issue: Volume: Page:
ISSN:
Container-title:56th Annual IEEE/ACM International Symposium on Microarchitecture
language:
Short-container-title:

Author:

Kim Michael Jaemin¹^ORCID,Wi Minbok¹^ORCID,Park Jaehyun¹^ORCID,Ko Seoyoung¹^ORCID,Choi Jaeyoung¹^ORCID,Nam Hwayoung¹^ORCID,Kim Nam Sung²^ORCID,Ahn Jung Ho¹^ORCID,Lee Eojin³^ORCID

Affiliation:

1. Seoul National University, Republic of Korea

2. UIUC, United States of America

3. Inha University, Republic of Korea

Funder

Institute of Information & communications Technology Planning & Evaluation

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3613424.3623777

Reference114 articles.

1. 2010. Intel Xeon Processor 7500 Series. https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/xeon-processor-7500-series-vol-2-datasheet.pdf. 2010. Intel Xeon Processor 7500 Series. https://www.intel.com/content/dam/www/public/us/en/documents/datasheets/xeon-processor-7500-series-vol-2-datasheet.pdf.

2. 2013. BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 15h Models 00h-0Fh Processors. https://www.amd.com/system/files/TechDocs/42301_15h_Mod_00h-0Fh_BKDG.pdf. 2013. BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 15h Models 00h-0Fh Processors. https://www.amd.com/system/files/TechDocs/42301_15h_Mod_00h-0Fh_BKDG.pdf.

3. Future scaling of processor-memory interfaces

4. McSimA+: A manycore simulator with application-level+ simulation and detailed microarchitecture modeling

5. Foiling Birthday Attacks in Length-Doubling Transformations

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PrIDE: Achieving Secure Rowhammer Mitigation with Low-Cost In-DRAM Trackers;2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA);2024-06-29

2. Read Disturbance in High Bandwidth Memory: A Detailed Experimental Study on HBM2 DRAM Chips;2024 54th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN);2024-06-24