Predicting electromigration mortality under temperature and product lifetime specifications
Author:
Affiliation:
1. University of Minnesota, Minneapolis, MN
Funder
NSF
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2897937.2898070
Reference18 articles.
1. Electromigration and its impact on physical design in future technologies
2. Electromigration in thin aluminum films on titanium nitride;Blech I. A.;J. Appl. Phys.,1976
3. Electromigration failure modes in aluminum metallization for semiconductor devices;Black J. R.;Proc. IEEE,1969
4. Reliability and early failure in Cu/oxide dual-damascene interconnects
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