Three-dimensional place and route for FPGAs-Reference-Cited by-同舟云学术

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Three-dimensional place and route for FPGAs

Published:2005 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2005 conference on Asia South Pacific design automation - ASP-DAC '05
language:
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Author:

Ababei Cristinel,Mogal Hushrav,Bazargan Kia

Publisher

ACM Press

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research into Low Thermal Gradient Oriented 3D FPGA Interconnect Channel Architecture Design;J ELECTRON INF TECHN;2019

2. Review of advanced FPGA architectures and technologies;Journal of Electronics (China);2014-10

3. Three-dimensional automatic routing for the design of moulded interconnect devices;International Journal of Computer Integrated Manufacturing;2011-03-21

4. Reliability-aware platform optimization for 3D chip multi-processors;The Journal of Supercomputing;2011-03-16

5. 10.5104/jiep.14.5;Journal of Japan Institute of Electronics Packaging;2011

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