CMH-Reference-Cited by-同舟云学术

CMH

Published:2018-05-08 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 15th ACM International Conference on Computing Frontiers
language:
Short-container-title:

Author:

Qian Cheng¹,Huang Libo¹,Yu Qi¹,Wang Zhiying¹,Childers Bruce²

Affiliation:

1. National University of Defense Technology, ChangSha, China

2. University of Pittsburgh

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3203217.3203235

Reference31 articles.

1. {n. d.}. Hybrid memory cube specification 2.1. ({n. d.}). https://www.hybridmemorycube.org {n. d.}. Hybrid memory cube specification 2.1. ({n. d.}). https://www.hybridmemorycube.org

2. {n. d.}. internal technology roadmap for semiconductors 2.0. ({n. d.}). https://www.semiconductors.org/ {n. d.}. internal technology roadmap for semiconductors 2.0. ({n. d.}). https://www.semiconductors.org/

3. {n. d.}. JEDEC specifications (Wide I/O HBM). ({n. d.}). https://www.jedec.org {n. d.}. JEDEC specifications (Wide I/O HBM). ({n. d.}). https://www.jedec.org

4. {n. d.}. Technology Roadmap of DRAM for Three Major manufacturers: Samsung SK-Hynix and Micron. ({n. d.}). https://www.techinsights.com/ {n. d.}. Technology Roadmap of DRAM for Three Major manufacturers: Samsung SK-Hynix and Micron. ({n. d.}). https://www.techinsights.com/

5. The Nas Parallel Benchmarks

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