TSocket

Author:

Chen Guoqing1,Xu Yi2,Hu Xing3,Guo Xiangyang4,Ma Jun5,Hu Yu6,Xie Yuan7

Affiliation:

1. AMD Research China Lab, Advanced Micro Devices, Inc., Beijing, China

2. Space Science Institute, Macau University of Science and Technology, Macau, China

3. Shannon Laboratory, Huawei Technologies Co., Ltd, Shenzhen, China

4. North Carolina State University, Raleigh, NC

5. Bureau of Geophysical Prospecting, China National Petroleum Corporation, Beijing, China

6. Institute of Computing Technology, Chinese Academy of Science, Beijing, China

7. University of California, Santa Barbara, CA

Abstract

As technology scales, thermal management for multicore architectures becomes a critical challenge due to increasing power density. Existing power budgeting techniques focus on maximizing performance under a given power budget by optimizing the core configurations. In multicore era, a chip-wide power budget, however, is not sufficient to ensure thermal constraints because the thermal sustainable power capacity varies with different threading strategies and core configurations. In this article, we propose two models to dynamically estimate the thermal sustainable power capacity in homogeneous multicore systems: uniform power model and nonuniform power model . These two models convert the thermal effect of threading strategies and core configurations into power capacity, which provide a context-based core power capacity for power budgeting. Based on these models, we introduce a power budgeting framework aiming to improve the performance within thermal constraints, named as TSocket. Compared to the chip-wide power budgeting solution, TSocket shows 19% average performance improvement for the PARSEC benchmarks in single program scenario and up to 11% performance improvement in multiprogram scenario. The performance improvement is achieved by reducing thermal violations and exploring thermal headrooms.

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Reference29 articles.

1. AMD. 2012. Bidirectional application power management. http://www.amd.com/documents/AMD_SFF-break Whitepaper.pdf. AMD. 2012. Bidirectional application power management. http://www.amd.com/documents/AMD_SFF-break Whitepaper.pdf.

2. Thermal and Energy Management of High-Performance Multicores: Distributed and Self-Calibrating Model-Predictive Controller

3. The gem5 simulator

4. When less is more (LIMO):controlled parallelism forimproved efficiency

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. T-TSP: Transient-Temperature Based Safe Power Budgeting in Multi-/Many-Core Processors;2021 IEEE 39th International Conference on Computer Design (ICCD);2021-10

2. Power-Temperature Stability and Safety Analysis for Multiprocessor Systems;ACM Transactions on Embedded Computing Systems;2017-10-10

3. A Variation-Aware Adaptive Fuzzy Control System for Thermal Management of Microprocessors;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2017-02

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