Exploring DRAM organizations for energy-efficient and resilient exascale memories-Reference-Cited by-同舟云学术

Exploring DRAM organizations for energy-efficient and resilient exascale memories

Published:2013-11-17 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the International Conference on High Performance Computing, Networking, Storage and Analysis
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Author:

Giridhar Bharan¹,Cieslak Michael¹,Duggal Deepankar¹,Dreslinski Ronald¹,Chen Hsing Min²,Patti Robert³,Hold Betina⁴,Chakrabarti Chaitali²,Mudge Trevor¹,Blaauw David¹

Affiliation:

1. University of Michigan, Ann Arbor, MI

2. Arizona State University, Tempe, AZ

3. Tezzaron Semiconductor, Naperville, IL

4. ARM Inc., San Jose, CA

Funder

Division of Computer and Network Systems

Advanced Scientific Computing Research

Defense Advanced Research Projects Agency

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/2503210.2503215

Reference45 articles.

1. Micron 1Gb DDR3 SDRAM Datasheet. http://www.micron.com/. Micron 1Gb DDR3 SDRAM Datasheet. http://www.micron.com/.

2. NEK5000. http://nek5000.mcs.anl.gov/. NEK5000. http://nek5000.mcs.anl.gov/.

3. Octopus 8-Port DRAM for Die-Stack Applications. http://www.tezzaron.com/. Octopus 8-Port DRAM for Die-Stack Applications. http://www.tezzaron.com/.

4. Tezzaron Semiconductor. http://www.tezzaron.com/. Tezzaron Semiconductor. http://www.tezzaron.com/.

5. Future scaling of processor-memory interfaces

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