Dapper

Author:

Chen Xuelin1,Zhang Hao2,Lin Jinjie1,Hu Ruizhen3,Lu Lin1,Huang Qixing4,Benes Bedrich5,Cohen-Or Daniel6,Chen Baoquan1

Affiliation:

1. Shandong Univ.

2. Simon Fraser Univ.

3. Shenzhen Inst. of Adv. Tech.

4. Toyota Tech. Inst.

5. Purdue Univ.

6. Tel Aviv Univ.

Funder

Guangdong Science and Technology Program

Israeli Science Foundation

NSERC Canada

Shenzhen VisuCA Key Lab

U.S.-Israel Bi-National Science Foundation

National 973 Program

NSFC

Publisher

Association for Computing Machinery (ACM)

Subject

Computer Graphics and Computer-Aided Design

Reference15 articles.

1. Efficient string matching

2. A survey of computational approaches to three-dimensional layout problems

3. Object modelling by registration of multiple range images

4. Crainic T. G. Perboli G. and Tadei R. 2012. Recent Advances in Multi-Dimensional Packing Problems. New Technologies - Trends Innovations and Research. Crainic T. G. Perboli G. and Tadei R. 2012. Recent Advances in Multi-Dimensional Packing Problems. New Technologies - Trends Innovations and Research.

5. Packing Subsets of 3D Parts for Layered Manufacturing

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2. Neural Packing: from Visual Sensing to Reinforcement Learning;ACM Transactions on Graphics;2023-12-05

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5. Learning Physically Realizable Skills for Online Packing of General 3D Shapes;ACM Transactions on Graphics;2023-07-28

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