Smart Memories

Author:

Mai Ken1,Paaske Tim1,Jayasena Nuwan1,Ho Ron1,Dally William J.1,Horowitz Mark1

Affiliation:

1. Computer Systems Laboratory, Stanford University, Stanford, California

Abstract

Trends in VLSI technology scaling demand that future computing devices be narrowly focused to achieve high performance and high efficiency, yet also target the high volumes and low costs of widely applicable general purpose designs. To address these conflicting requirements, we propose a modular reconfigurable architecture called Smart Memories, targeted at computing needs in the 0.1μ technology generation. A Smart Memories chip is made up of many processing tiles, each containing local memory, local interconnect, and a processor core. For efficient computation under a wide class of possible applications, the memories, the wires, and the computational model can all be altered to match the applications. To show the applicability of this design, two very different machines at opposite ends of the architectural spectrum, the Imagine stream processor and the Hydra speculative multiprocessor, are mapped onto the Smart Memories computing substrate. Simulations of the mappings show that the Smart Memories architecture can successfully map these architectures with only modest performance degradation.

Publisher

Association for Computing Machinery (ACM)

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. On the Reliability of Computing-in-Memory Accelerators for Deep Neural Networks;Springer Series in Reliability Engineering;2022-07-26

2. A Classification of Memory-Centric Computing;ACM Journal on Emerging Technologies in Computing Systems;2020-04-30

3. MAHASIM: Machine-Learning Hardware Acceleration Using a Software-Defined Intelligent Memory System;Journal of Signal Processing Systems;2020-02-28

4. Processing-in-Memory: Exploring the Design Space;Lecture Notes in Computer Science;2015

5. ReKonf: Dynamically reconfigurable multiCore architecture;Journal of Parallel and Distributed Computing;2014-11

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