Author:
Liu Xiaodong,Zhang Yifan,Yeap Gary K.,Chu Chunlei,Sun Jian,Zeng Xuan
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Fast Escape Router for Large-Scale Staggered-Pin-Array PCBs;2023 International Symposium of Electronics Design Automation (ISEDA);2023-05-08
2. Intelligent design automation for 2.5/3D heterogeneous SoC integration;Proceedings of the 39th International Conference on Computer-Aided Design;2020-11-02
3. A routing framework for technology migration with bump encroachment;Integration;2017-06
4. Redistribution layer routing for integrated fan-out wafer-level chip-scale packages;Proceedings of the 35th International Conference on Computer-Aided Design;2016-11-07