Full chip leakage estimation considering power supply and temperature variations-Reference-Cited by-同舟云学术

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Full chip leakage estimation considering power supply and temperature variations

Published:2003 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2003 international symposium on Low power electronics and design - ISLPED '03
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Author:

Su Haihua,Liu Frank,Devgan Anirudh,Acar Emrah,Nassif Sani

Publisher

ACM Press

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Novel Thermal Modeling of Through Silicon Vias in 3-D IC structures;International Journal of Materials;2021-01-15

2. A Survey of Chip-level Thermal Simulators;ACM Computing Surveys;2019-05-31

3. Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint;Journal of Computer Science and Technology;2018-09

4. A novel power model for future heterogeneous 3D chip-multiprocessors in the dark silicon age;EURASIP Journal on Embedded Systems;2018-07-27

5. Multiscale Thermal Management of Computing Systems - The MULTITHERMAN approach;IFAC-PapersOnLine;2017-07

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