MOCA
Author:
Affiliation:
1. The Hong Kong University of Science and Technology
2. National University of Defense Technology
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3061639.3062286
Reference24 articles.
1. Combining memory and a controller with photonics through 3D-stacking to enable scalable and energy-efficient systems
2. A. Hadke etal "Design and Evaluation of an Optical CPU-DRAM Interconnect " in ICCD 2008. A. Hadke et al. "Design and Evaluation of an Optical CPU-DRAM Interconnect " in ICCD 2008.
3. Re-architecting DRAM memory systems with monolithically integrated silicon photonics
4. Building Manycore Processor-to-DRAM Networks with Monolithic Silicon Photonics
5. D. Brunina etal "An Energy-Efficient Optically Connected Memory Module for Hybrid Packet- and Circuit-Switched Optical Networks " JSTQE vol. 19 March 2013. D. Brunina et al. "An Energy-Efficient Optically Connected Memory Module for Hybrid Packet- and Circuit-Switched Optical Networks " JSTQE vol. 19 March 2013.
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1. Integration of Nanoscale and Macroscale Graphene Heterostructures for Flexible and Multilevel Nonvolatile Photoelectronic Memory;ACS Applied Nano Materials;2019-12-27
2. 3D photonics as enabling technology for deep 3D DRAM stacking;Proceedings of the International Symposium on Memory Systems;2019-09-30
3. A Fast Joint Application-Architecture Exploration Platform for Heterogeneous Systems;Embedded, Cyber-Physical, and IoT Systems;2019-06-29
4. CustomTopo;Proceedings of the International Conference on Computer-Aided Design;2018-11-05
5. AWGR-based optical processor-to-memory communication for low-latency, low-energy vault accesses;Proceedings of the International Symposium on Memory Systems;2018-10
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