Flip-chip routing with unified area-I/O pad assignments for package-board co-design

Author:

Fang Jia-Wei,Wong Martin D. F.,Chang Yao-Wen

Publisher

ACM Press

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Physical Design Challenges in Modern Heterogeneous Integration;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12

2. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

3. Reshaping System Design in 3D Integration;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26

4. Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

5. Unet-Astar: A Deep Learning-Based Fast Routing Algorithm for Unified PCB Routing;IEEE Access;2023

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