On Runtime Communication- and Thermal-aware Application Mapping in 3D NoC-Reference-Cited by-同舟云学术

On Runtime Communication- and Thermal-aware Application Mapping in 3D NoC

Published:2017-10-19 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip
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Author:

Li Bing¹,Wang Xiaohang¹,Singh Amit Kumar²,Mak Terrence³

Affiliation:

1. South China University of Technology, China

2. Department of Electronics and Computer Science, University of Southampton, UK

3. Department of Electronics and Computer Science, University of Southampton, UK, Shenzhen Institute of Advanced Technology and Guangzhou Institute of Advanced Technology, CAS, China

Funder

NSFC

he Science and Technology Research Grant of Guangdong Province

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3130218.3130228

Reference28 articles.

1. Distributed run-time resource management for malleable applications on many-core platforms

2. The PARSEC benchmark suite

3. Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems

4. Thermal-aware mapping of streaming applications on 3D Multi-Processor Systems

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