Affiliation:
1. University of Virginia
Abstract
Due to non-ideal technology scaling, delivering a stable supply voltage is increasingly challenging. Furthermore, com- petition for limited chip interface resources (i.e., C4 pads) between power supply and I/O, and the loss of such resources to electromigration, means that constructing a power deliverynetwork (PDN) that satisfies noise margins without compromising performance is and will remain a critical problem for architects and circuit designers alike. Simple guardbanding will no longer work, as the consequent performance penalty will grow with technology scaling
In this paper, we develop a pre-RTL PDN model, VoltSpot, for the purpose of studying the performance and noise tradeoffs among power supply and I/O pad allocation, the effectiveness of noise mitigation techniques, and the consequent implications of electromigration-induced PDN pad failure. Our simulations demonstrate that, despite their integral role in the PDN, power/ground pads can be aggressively reduced (by conversion into I/O pads) to their electromigration limit with minimal performance impact from extra voltage noise - provided the system implements a suitable noise-mitigation strategy. The key observation is that even though reducing power/ground pads significantly increases the number of voltage emergencies, the average noise amplitude increase is small. Overall, we can triple I/O bandwidth while maintaining target lifetimes and incurring only 1.5% slowdown
Funder
National Science Foundation
Defense Advanced Research Projects Agency
Division of Computer and Network Systems
Publisher
Association for Computing Machinery (ACM)
Reference39 articles.
1. C. Bienia "Benchmarking modern multiprocessors " Ph.D. dissertation Princeton University 2011. C. Bienia "Benchmarking modern multiprocessors " Ph.D. dissertation Princeton University 2011.
2. The gem5 simulator
3. Electromigration—A brief survey and some recent results
4. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
5. I. J. Chung Modeling and Hybrid Simulation of On-chip Power Delivery Network Using an Unconditionally Stable Electromagnetic Field Solver. ProQuest 2007. I. J. Chung Modeling and Hybrid Simulation of On-chip Power Delivery Network Using an Unconditionally Stable Electromagnetic Field Solver. ProQuest 2007.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献