Therminator

Author:

Xie Qing1,Dousti Mohammad Javad1,Pedram Massoud1

Affiliation:

1. University of Southern California, Los Angeles, CA, USA

Funder

Defense Advanced Research Projects Agency

National Science Foundation

Publisher

ACM

Reference28 articles.

1. Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

2. J. Srinivasan etal "The case for lifetime reliability-aware microprocessors " in ISCA 2004. J. Srinivasan et al. "The case for lifetime reliability-aware microprocessors " in ISCA 2004.

3. Generic thermal analysis for phone and tablet systems;Gurrum S. P.;ECTC,2012

4. Thermal management of embedded devices;Rajmond J.;ISSE,2013

5. A. L. Shimpi "The ARM vs x86 Wars Have Begun: In-Depth Power Analysis of Atom Krait & Cortex A15." {Online}. Available: http://www.anandtech.com/show/6536/arm-vs-x86-the-real-showdown. A. L. Shimpi "The ARM vs x86 Wars Have Begun: In-Depth Power Analysis of Atom Krait & Cortex A15." {Online}. Available: http://www.anandtech.com/show/6536/arm-vs-x86-the-real-showdown.

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1. A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-01

2. An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction;Microelectronics Reliability;2023-07

3. Efficient transient thermal analysis of chiplet heterogeneous integration;Applied Thermal Engineering;2023-07

4. MixMax: Leveraging Heterogeneous Batteries to Alleviate Low Battery Experience for Mobile Users;Proceedings of the 21st Annual International Conference on Mobile Systems, Applications and Services;2023-06-18

5. Modeling and design of monolithically coated thermal components;International Journal of Heat and Mass Transfer;2023-05

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