Author:
Wang Chenghan,Xu Qinzhi,Nie Chuanjun,Cao He,Liu Jianyun,Li Zhiqiang
Funder
Chinese Academy of Sciences
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Cramming more components onto integrated circuit;Moore;Electronics,1965
2. Architecture, chip, and package co-design flow for 2.5D IC design enabling heterogeneous IP reuse;Kim,2019
3. Efficient thermal analysis of chiplet heterogeneous integration;Nie;Appl. Therm. Eng.,2023
4. IntAct: a 96-core processor with six chiplets 3D-stacked on an active interposer with distributed interconnects and integrated power management;Vivet;IEEE J. Solid State Circuits,2021
5. ISPD 2021 wafer-scale physics modeling contest, a new frontier in partitioning, placement and routing;Groeneveld,2021
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