Affiliation:
1. Department of Materials Chemistry, Faculty of Engineering, Yokohama National University, Japan
Publisher
Surface Science Society Japan
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics,Bioengineering,Biotechnology
Reference17 articles.
1. [1] A. C. Tan, Tin and Solder Plating in the Semiconductor Industry, Chapman and Hall, 1993.
2. Role of halides in the electroplating of tin from the alkaline-stannate bath
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献