Affiliation:
1. Yokohama National University
2. Southern Taiwan University of Technology
Abstract
This study concerns the development of Pb free solder plating due to environmental concerns. The composition of the bath was 0.1 mol/dm3 SnY and 0.1 mol/dm3 BiY- in 2 mol/dm3 CH3COOH - 2 mol/dm3 CH3COONa buffer solution (pH 4.0). The bath used 100 cm3 of solution. Plating was carried out at a current density of 50 mA/cm2 using ultrasonic agitation (sonication) at 28 kHz (100 W). Various percentages of a Sn - Bi alloy could be plated. A 41wt.%Sn - 59 wt.%Bi alloy with a melting point of 415 K was obtained from a [BiY-]/[BiY-+SnY] = 0.3 bath. The surface morphologies of the plated films showed a striking difference in accordance with a change of composition.
Publisher
Trans Tech Publications, Ltd.
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