Solid Logic Technology: Versatile, high-performance microelectronics-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Solid Logic Technology: Versatile, high-performance microelectronics

Published:2000-01 Issue:1.2 Volume:44 Page:56-68
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Davis E. M.,Harding W. E.,Schwartz R. S.,Corning J. J.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5389177/05389188.pdf?arnumber=5389188

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Life cycle trends of electronic materials, processes and components;Microelectronics Reliability;2019-08

2. Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer;Journal of Electronic Materials;2010-06-02

3. Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints;Journal of Electronic Materials;2010-04-02

4. Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates;Journal of Electronic Materials;2009-06-30

5. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints;Journal of Applied Physics;2006-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP