Life cycle trends of electronic materials, processes and components-Reference-Cited by-同舟云学术

Life cycle trends of electronic materials, processes and components

Published:2019-08 Issue: Volume:99 Page:262-276
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Huang Chien-Ming,Romero Jose A.,Osterman Michael,Das Diganta,Pecht Michael

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference79 articles.

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3. Dealing with obsolete parts;Stogdill;IEEE Des. Test Comput.,1999

4. The electronic part life-cycle;Pecht,2000

5. Electronic part life-cycle concepts and obsolescence forecasting;Solomon,2000

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