Controlled collapse reflow chip joining
-
Published:2000-01
Issue:1.2
Volume:44
Page:93-104
-
ISSN:0018-8646
-
Container-title:IBM Journal of Research and Development
-
language:
-
Short-container-title:IBM J. Res. & Dev.
Subject
General Computer Science
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Interfacial void ripening in Cu Cu joints;Materials Characterization;2021-11
3. Self‐Folding Using Capillary Forces;Advanced Materials Interfaces;2019-12-09
4. Microstructure and Property of Au stud/Lead-free solder composite joint;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08