Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder-Reference-Cited by-同舟云学术

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Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Shen Zesheng¹,An Yuxuan¹,Xiong Zishan²,Tu King-Ning³,Liu Yingxia¹

Affiliation:

1. City University of HongKong HKSAR,Department of System Engineering,China

2. City University of HongKong HKSAR,Department of Electrical Engineering,China

3. City University of HongKong HKSAR,Department of Material Science and Engineering, Department of Electrical Engineering, Department of System Engineering,China

Funder

University of Hong Kong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492344.pdf?arnumber=10492344

Reference14 articles.

1. A metastable phase of tin in 3D integrated circuit solder microbumps

2. Reliability challenges in 3D IC packaging technology

3. FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

4. Sub 50-nm FinFET: PMOS

5. Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

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