Redistribution Layers (RDLs) for 2.5D/3D IC Integration
Author:
Affiliation:
1. 1Electronics & Optoelectronics Research Laboratory, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
2. 2Rambus Inc., 1050 Enterprise Way, Suite 700, Sunnyvale, CA 94089, USA
Abstract
Publisher
IMAPS - International Microelectronics Assembly and Packaging Society
Subject
General Medicine
Link
http://meridian.allenpress.com/ism/article-pdf/2013/1/000434/2253924/isom-2013-wa12.pdf
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