Silicon Carbide High Temperature Operational Amplifier

Author:

Vert Alexey1,Chen Cheng-Po1,Patil Amita1,Saia Rich1,Andarawis Emad1,Kashyap Avinash1,Zhang Tan1,Shaddock Dave1,Shen Zhenzhen2,Johnson R. Wayne2,Normann Randy3

Affiliation:

1. GE Global Research, 1 Research Circle, Niskayuna, NY 12309

2. Auburn University, 200 Broun Hall/ECE Dept., Auburn, AL 36849

3. Perma Works, LLC, 9916 Bell Ave SE, Albuquerque, NM 87123

Abstract

Development of silicon carbide operational amplifier offers an attractive alternative building block for the replacement of silicon and silicon-on-insulator analog circuits in harsh environment applications. NMOS-based enhancement mode silicon carbide device technology was utilized to demonstrate feasibility of operational amplifiers for use in harsh environment applications. This study reports on the results of characterization of operational amplifiers at room temperature and high temperatures up to 350°C. The development of high temperature packaging techniques enabled assembly of a functional oscillator board tested up to 350°C. A test fixture with high temperature sockets enabling quick swap of operational amplifiers is also discussed as an important tool in high temperature electronics research and development.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

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