Thermal, adhesive and solvent bonding techniques for polymer and polymer-glass microchip device fabrication-Reference-Cited by-同舟云学术

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Thermal, adhesive and solvent bonding techniques for polymer and polymer-glass microchip device fabrication

Published:2016-05-25 Issue:2 Volume:26 Page:64-74
ISSN:0868-5886
Container-title:NAUCHNOE PRIBOROSTROENIE
language:
Short-container-title:NP

Author:

Lukashenko T. A., ,Tupik A. N.,Rudnitskaya G. E.,Bulyanitsa A. L.,Tsimbalov A. I.,Evstrapov A. A., , , , , , ,

Publisher

Institute for Analytical Instrumentation of the Russian Academy of Sciences

Subject

General Medicine

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Domestic photo-cured acrylate glues for adhesive bonding microfluidic chips from polymethylmethacrylate;Plasticheskie massy;2023-01-17

2. Two-phase flow patterns investigation in large aspect ratio microchannel with T-mixer;E3S Web of Conferences;2023

3. Solvents for Sealing Microfluidic Devices Made of Polymethyl Methacrylate by Chemical Solvent Bonding;Polymer Science, Series D;2021-07

4. Features of a Non-Detachable Adhesive Bonding of Parts of Microfluid Devices from Polymethyl Methacrylate;Polymer Science, Series D;2021-04

5. Study of the Effect of Material of Microfluid Chip on the Polymerase Chain Reaction;Technical Physics;2020-09

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