Visualization of Subsurface Damage in Silicon Nitride from Grinding by a Plasma Etching and Dye Impregnation Method-Reference-Cited by-同舟云学术

Visualization of Subsurface Damage in Silicon Nitride from Grinding by a Plasma Etching and Dye Impregnation Method

Published:2006-08 Issue:8 Volume:89 Page:2564-2570
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J American Ceramic Society

Author:

Kanematsu Wataru

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1551-2916.2006.01115.x/fullpdf

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4. 4P. P. John , "Status of Silicon Nitride Component Fabrication Processes, Material Properties, and Applications "; ASME, Turbo Expo 97, Paper 97-GT-321, 1997.

5. Surface/subsurface damage and the fracture strength of ground ceramics

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