High-Thermal-Conductivity AlN Filler for Polymer/Ceramics Composites-Reference-Cited by-同舟云学术

High-Thermal-Conductivity AlN Filler for Polymer/Ceramics Composites

Published:2009-01 Issue: Volume:92 Page:S153-S156
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:

Author:

Kume Shoichi,Yamada Ikuko,Watari Koji,Harada Isao,Mitsuishi Kenshi

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1551-2916.2008.02650.x/fullpdf

Reference35 articles.

1. Thermal Conductivity of Polystyrene-Aluminum Nitride Composite;Yu,2002

2. Preparation and the Properties of PMR-Type Polyimide Composites with Aluminum Nitride;Wang,2003

3. Thermal Conductivity Enhancement of Electrically Insulating Syndiotactic Poly (Styrene) Matrix for Diphasic Conductive Polymer Composites;Droval,2006

4. High Thermal Conductivity Epoxy Molding Compound Filled with a Combustion Synthesized AlN Powder;Hsieh,2006

5. Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler;Lee,2006

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