Author:
Ishikawa Yuki,Takao Tomoya,Saito Takeyasu
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Ultra High Voltage Semiconductor Power Devices for Grid Applications;Rahimo,2010
2. Ferrites in transfer-molded power SiPs: challenges in package;Thomas;J. Microelectron. Electron. Packag.,2020
3. Transfer molding technology for smart power electronics modules: materials and processes;Becker;J. Microelectron. Electron. Packag.,2012
4. Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs;Ceccarelli,2019
5. Development of advanced all-SiC power modules;Liang;IEEE Trans. Power Electron.,2014
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