Influence of Cu2O on Interface Behavior of Copper/SiCpComposite Prepared by Spark Plasma Sintering
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1551-2916.2004.00302.x/fullpdf
Reference21 articles.
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2. Silicon Carbide Whisker Copper-Matrix Composites Fabricated by Hot Pressing Copper Coated Whiskers;Yih;J. Mater. Sci.,1996
3. The Friction and Wear of Cu-Based Silicon Carbide Particulate Metal Matrix Composites for Brake Applications;Kennedy;Wear,1997
4. Effects of SiCp Reinforcement by Electroless Copper Plating on Properties of Cu/SiCp Composites;Lee;Powder Metall.,1999
5. Electrical Properties and Thermal Stability of Cu/6H-SiC Junctions;Suezak;Jpn. J. Appl. Phys.,2001
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