Effects of SiCpreinforcement by electroless copper plating on properties of Cu/SiCpcomposites
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites
Link
http://www.tandfonline.com/doi/pdf/10.1179/003258999665495
Reference14 articles.
1. Ceramic and Glass-Ceramic Packaging in the 1990s
2. Coefficients of thermal expansion of metal-matrix composites for electronic packaging
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