Considering the possibility of bonding utilizing cold sintering for ceramic adhesives-Reference-Cited by-同舟云学术

Considering the possibility of bonding utilizing cold sintering for ceramic adhesives

Published:2017-08-11 Issue:12 Volume:100 Page:5421-5432
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J Am Ceram Soc

Author:

Chen Wei‐Ting¹,Gurdal Ahmet Erkan¹,Tuncdemir Safakcan¹,Guo Jing¹,Guo Hanzheng¹,Randall Clive A.¹^ORCID

Affiliation:

1. Center for Dielectrics and Piezoelectrics Materials Research Institute Department of Materials Science and Engineering The Pennsylvania State University University Park Pennsylvania

Funder

National Aeronautics and Space Administration

Directorate for Engineering

National Science Foundation

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/jace.15098

Reference54 articles.

1. A New Material for High‐Temperature Lead‐Free Actuators

2. Thin-film piezoelectric bimorph actuators with increased thickness using double Pb[Zr,Ti]O3layers

3. A Novel Co-casting Process for Piezoelectric Multilayer Ceramics with Silver Inner Electrodes

4. Piezoelectric materials for high temperature transducers and actuators

5. A study on co-firing between Zn0.9Mg0.1TiO3 and ZnO-based multilayer varistor

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