Al2O3-Al2O3 and Al2O3-Ti Solder Joints-Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties

Author:

Leinenbach Christian1,Weyrich Nico1,Elsener Hans-Rudolf1,Gamez Gerardo2

Affiliation:

1. Empa - Swiss Federal Laboratories for Materials Science and Technology; Laboratory for Joining and Interface Technology; CH-8600; Dübendorf; Switzerland

2. Empa - Swiss Federal Laboratories for Materials Science and Technology; Laboratory for Mechanics of Materials and Nanostructures; CH-3602; Thun; Switzerland

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Reference28 articles.

1. Joining of Alumina via Copper/Niobium/Copper Interlayer;Marks;Acta Mater.,2000

2. Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics;Sugar;J. Eur. Ceram. Soc.,2006

3. Interface Compounds Formed During the Diffusion Bonding of Al2O3 to Ti;Kliauga;J. Mater. Sci.,2000

4. Al2O3/Ti6Al4V Diffusion Bonding Joints Using Ag-Cu Interlayer;Barrena;Mater. Charact.,2009

5. Influence of Surface Modification of Alumina on Bond Strength in Al2O3/Al/Al2O3 Joints;Ksiazek;J. Mater. Sci.,2005

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