Al2O3/Ti6Al4V diffusion bonding joints using Ag–Cu interlayer
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Joining of Al2O3p/Al composites by transient liquid phase (TLP) bonding and novel process of active-transient liquid phase (A-TLP) bonding;Zhang;Mat Sci Eng A-Struct,2008
2. Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy;Lemus-Ruiz;J Mater Sci,2008
3. Interfacial microstructure and forming mechanism of brazing Cf/Al composite with Al–Si filler;He;Mat Sci Eng A-Struct,2006
4. Studying of micro-bonding in diffusion welding joint for composite;Liu;Mat Sci Eng A-Struct,2001
5. Diffusion bonding of an aluminium–copper alloy reinforced with silicon carbide particles (AA2014/SiC/13p) using metallic interlayers;Ureña;Scripta Mater,1996
Cited by 54 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of Microstructure and Interfacial Reactions of Diffusion Bonding of Ni-Ti6Al4V Materials Joined by Using Ag Interlayer;Materials;2024-09-11
2. Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate;Soldering & Surface Mount Technology;2024-06-05
3. Effect of laser power, speed and offset on the welding performance of 304 SS/Al2O3 ceramics;Ceramics International;2024-02
4. Microstructure and Mechanical Properties of Ti6Al4V to Al2O3 Brazed Joints Using Ti-Ag/Cu-Ti Thin Films;Metals;2024-01-24
5. Investigations on the diffusion bonding of titanium alloy and aluminum alloy using copper at low bonding pressure;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-09-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3