Direct‐bonded Al/Al 2 O 3 using a transient eutectic liquid phase-Reference-Cited by-同舟云学术

Direct‐bonded Al/Al 2 O 3 using a transient eutectic liquid phase

Published:2020-02-19 Issue:4 Volume:17 Page:1652-1660
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int J Appl Ceram Technol

Author:

Cheng Yun‐Hsiang¹,Lin Chien‐Cheng¹,Lin Kun‐Lin²^ORCID

Affiliation:

1. Department of Materials Science and Engineering National Chiao Tung University Hsinchu Taiwan

2. Taiwan Semiconductor Research Institute National Applied Research Laboratories Hsinchu Taiwan

Funder

Ministry of Science and Technology, Taiwan

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijac.13489

Reference19 articles.

1. LeiG.Thermal‐mechanical reliability of low‐temperature sintered attachments on direct bonded aluminum (DBA) substrate for high‐temperature electronics packaging. PhD Dissertation;Virginia Polytechnic Institute and State University 2010.

2. Survey of High-Temperature Reliability of Power Electronics Packaging Components

3. Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate

4. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

5. Interface Of Aluminum/Ceramic Power Substrates Manufactured By Casting-Bonding Process

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