Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer
Author:
Funder
National Science Council
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-023-08754-3.pdf
Reference25 articles.
1. Schulz-Harder J (2003) Advantages and new development of directly bonded copper substrates. Microelectron Reliab 43:359–365
2. Xu L, Wang M, Zhou Y et al (2016) An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling. Microelectron Reliab 56:101–108
3. Dupont L, Khatir Z, Lefebvre S et al (2006) Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectron Reliab 46:1766–1771
4. Lei TG, Calata JN, Ngo KD et al (2009) Effects of large-temperature cycling range on direct bond aluminum substrate. IEEE Trans Device Mater Reliab 9:563–568
5. Lindemann A, Strauch G (2007) Properties of direct aluminum bonded substrates for power semiconductor components. IEEE Trans Power Electron 22:384–391
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