Author:
Liu D. S.,Shih Y. S.,Ni C. Y.,Chiou D. Y.,Chung C. L.,Huang M. L.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference10 articles.
1. Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
2. 2. J. H. Lau , "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions ," Proc. Japan Int. Electro. Manuf. Technol. Symp., 13 -19 , 1995 .
3. Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions
4. 4. P. Lall, G. Gold, B. Miles, K. Banerji, P. Thompson, C. Koehler, and I. Adhihetty , "Reliability Characterization of the SLICC Package ," Proc. Electron. Compon. Technol. Conf., 1202 -1210 , 1996 .
5. Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献