Role of Oxygen in Microstructure Development at Solid-State Diffusion-Bonded Cu/alpha-Al2O3 Interfaces
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1994.tb07094.x/fullpdf
Reference26 articles.
1. The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method
2. Eutectic Bonding of Copper to Ceramics
3. Study of copper-alumina bonding
4. Role of Oxygen in Bonding Copper to Alumina
5. Interfacial phase transitions and bonding in the Cu/Al2O3system
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